In modern electronics manufacturing, BGA PCB Assembly has become one of the most reliable and efficient packaging technologies for compact devices. With its ability to support high-pin-count components, improved thermal performance, and stable solder joints, it is widely used in communication equipment, consumer electronics, industrial control systems, and automotive electronics. As technology evolves toward miniaturization and high performance, companies like Shenzhen Fanway Technology Co., Ltd. provide advanced BGA PCB AssemblyMga solusyon na matiyak ang pinakamainam na kalidad, katumpakan, at tibay.
BGA (Ball Grid Array) devices use solder balls arranged in a grid underneath the component instead of pins located on the perimeter. This structural difference brings several key advantages:
Higher connection density
Better electrical conductivity
Enhanced heat dissipation
Superior performance stability
Reduced risk of solder bridging
This technology is especially valuable when your product requires more robust signal integrity and tighter packaging than conventional SMD components can deliver.
The application of BGA PCB Assembly significantly boosts overall device performance. Its hidden solder balls shorten electrical paths, lowering resistance and improving signal transmission speed. Moreover, the larger contact area of solder balls enhances heat conduction, allowing high-power chips and processors to remain stable during long-term operation. For industries requiring reliable and compact electronics, this assembly method becomes indispensable.
Key Performance Benefits:
Mas mababang impedance at pinabuting pagganap ng mataas na dalas
Malakas na koneksyon ng mekanikal para sa mga aplikasyon na lumalaban sa panginginig ng boses
Excellent thermal management
Ang pagtaas ng kakayahan sa pagproseso para sa mga CPU, GPU, at IC
Nasa ibaba ang isang pangkalahatang -ideya ng mga parameter ng pagmamanupaktura na suportado ngShenzhen Fanway Technology Co., Ltd. for BGA PCB Assembly.
1. Assembly Capability Overview
| Parameter Category | Specification |
|---|---|
| Package Types | BGA, Micro-BGA, CSP, LGA, QFN |
| Ball Pitch | 0.25 mm – 1.27 mm |
| Min. PCB Thickness | 0.4 mm |
| Max. PCB Size | 510 mm × 510 mm |
| Assembly Types | Leaded / Lead-free BGA |
| Inspection Method | X-ray, AOI, Functional Testing |
| Rework Capability | BGA removal, reballing, replacement |
2. Soldering & Inspection Parameters
Reflow Temperature Control: ±1°C accuracy
Voids rate: <10% (na -optimize para sa mga premium na aplikasyon)
Coplanarity Tolerance: < 0.1 mm
Alignment Precision: ±20 μm
Katumpakan ng paglalagay: Hanggang sa 01005 na mga sangkap na suportado sa tabi ng BGA
3. PCB Material Compatibility
FR4 High-Tg
Polyimide (PI)
Rogers high-frequency boards
Hybrid multilayer PCBs
HDI boards with blind/buried vias
These parameters ensure stable, repeatable, and high-precision assembly for even the most complex BGA projects.
Industries that require precision, durability, and high component density consistently choose BGA PCB Assembly because it ensures:
Minimal signal delay
Long-term thermal stability
Strong mechanical bonding
Low failure rate under continuous operation
Excellent EMC performance
Industries Widely Applying BGA PCB Assembly:
Mga elektronikong consumer (mga smartphone, tablet, laptop)
Industrial control equipment
Automotive electronics and navigation systems
Medical electronics
Network communication devices
Aerospace and defense electronics
Shenzhen Fanway Technology Co., Ltd. offers tailored BGA solutions to meet these demanding industry conditions.
Reliability depends heavily on process control, inspection technology, and engineering expertise. We employ:
Quality Control Measures:
Automated Optical Inspection (AOI)
Nakita ang kaunting maling pag -misalignment, mga depekto sa panghinang, at mga isyu sa orientation ng sangkap.
X-ray Inspection
Mahalaga para sa mga nakatagong mga kasukasuan ng panghinang sa ilalim ng mga pakete ng BGA.
Mga tseke para sa mga voids, bridging, hindi sapat na panghinang, at bukas na mga koneksyon.
Reflow Profiling Optimization
Tinitiyak ang mga bola ng panghinang na ganap na matunaw at bumubuo ng mga pantay na koneksyon.
Professional Rework Technology
Our engineers can safely replace, reball, and realign BGA components without damaging the PCB.
These techniques ensure every board meets global quality standards such as IPC-A-610 and ISO9001.
The true value of BGA PCB Assemblynamamalagi sa kakayahang matulungan ang mga produktong disenyo ng mga inhinyero na:
Smaller
Faster
More energy-efficient
More reliable under harsh conditions
Because BGA packages sit directly above solder balls, electrical pathways shorten and resistance reduces. This structure is ideal for products requiring fast data processing or compact internal layout. For example, devices using CPUs, memory chips, Bluetooth modules, or advanced networking ICs greatly benefit from BGA assembly.
Upang matiyak ang pinakamainam na pagganap, dapat suriin ng mga inhinyero:
Design Considerations:
Adequate pad diameter
Proper solder mask design
Via-in-pad structure if necessary
PCB heat distribution
Reflow curve configuration
Suitable material and layer count
Production Considerations:
The precision of placement equipment
X-ray inspection capability
Ang karanasan sa engineering na may mga disenyo ng high-density
Rework and repair capability
Shenzhen Fanway Technology Co., Ltd. provides comprehensive engineering support, helping you optimize layout, reduce assembly risk, and improve manufacturing yield.
Q1: What is BGA PCB Assembly and why is it widely used?
A: BGA PCB Assembly is a method of mounting Ball Grid Array components onto printed circuit boards using solder balls arranged underneath the package. It is widely used because it provides high-density connections, stable electrical performance, and excellent heat dissipation, which are essential for modern compact electronic devices.
Q2: Paano mapapabuti ng pagpupulong ng BGA PCB ang pagiging maaasahan ng aking produkto?
A: Its structure creates strong mechanical connections and improves thermal conduction. These factors reduce failure rates, enhance performance stability, and allow the PCB to operate efficiently under continuous high-load conditions.
Q3: What inspections are needed during BGA PCB Assembly?
A: X-ray inspection is mandatory to verify hidden solder joints. AOI and functional testing are also recommended to ensure alignment accuracy, proper soldering, and electrical performance.
Q4: Can Shenzhen Fanway Technology Co., Ltd. handle complex BGA PCB Assembly projects?
A: Yes. We support fine-pitch BGA, Micro-BGA, CSP, and HDI boards with advanced precision placement, reflow control, X-ray testing, and rework capabilities, making us a reliable partner for full-range BGA assembly services.
Kung ang iyong proyekto ay nangangailangan ng matatag, mataas na katumpakan, at mataas na pagganapBGA PCB Assembly, ang aming koponan sa engineering ay handa na suportahan ang iyong pag -unlad mula sa prototyping hanggang sa paggawa ng masa.
For more information or technical consultation, please contact Shenzhen Fanway Technology Co., Ltd.- Ang iyong pinagkakatiwalaang kasosyo sa advanced na elektronikong pagmamanupaktura.
